Method of manufacturing a semiconductor component and structure

ABSTRACT

A semiconductor component and methods for manufacturing the semiconductor component that includes a three dimensional helically shaped common mode choke. In accordance with embodiments, a transient voltage suppression device may be coupled to the monolithically integrated common mode choke.

TECHNICAL FIELD

The present invention relates, in general, to semiconductor components and, more particularly, to signal transmission in semiconductor components.

BACKGROUND

Transmission protocols within communications systems may include the use of single-ended signals, differential signals, or combinations of single-ended and differential signals. For example, single-ended signals and differential signals are suitable for use in portable communications systems that employ low speed data transmission. However, in communications systems that employ high speed data transmission such as in Universal Serial Bus (USB) applications, it is desirable to use differential signals because of their noise immunity properties.

Accordingly, it would be advantageous to have a structure and method for maintaining the amplitude and phase of a differential signal, while filtering out spurious common-mode signals introduced by, for example, transmission line effects. It would be of further advantage for the structure and method to be cost efficient to implement.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will be better understood from a reading of the following detailed description, taken in conjunction with the accompanying drawing figures, in which like reference characters designate like elements and in which:

FIG. 1 is a cross-sectional view of a semiconductor component at an early stage of manufacture in accordance with an embodiment of the present invention;

FIG. 2 is a cross-sectional view of the semiconductor component of FIG. 1 at a later stage of manufacture;

FIG. 3 is a cross-sectional view of the semiconductor component of FIG. 2 at a later stage of manufacture;

FIG. 4 is a cross-sectional view of the semiconductor component of FIG. 3 at a later stage of manufacture;

FIG. 5 is a cross-sectional view of the semiconductor component of FIG. 4 taken along the region of section line 5-5 in FIG. 6;

FIG. 6 is a top view of the semiconductor component of FIG. 4 at a later stage of manufacture;

FIG. 7 is a cross-sectional view of the semiconductor component of FIG. 6 at a later stage of manufacture;

FIG. 8 is a cross-sectional view taken along section line 8-8 of FIG. 11, but at an earlier stage of manufacture;

FIG. 9 is a cross-sectional view taken along section line 9-9 of FIG. 11, but at an earlier stage of manufacture;

FIG. 10 is a cross-sectional view of the semiconductor component of FIG. 8 at a later stage of manufacture;

FIG. 11 is a top view of the semiconductor component of FIG. 9 at a later stage of manufacture;

FIG. 12 is top view of the semiconductor component of FIG. 11 at a later stage of manufacture;

FIG. 13 is a cross-sectional view of a semiconductor component of FIG. 17 taken along section line 18-18 of FIG. 17, but at an earlier stage of manufacture;

FIG. 14 is a cross-sectional view of the semiconductor component of FIG. 13 at a later stage of manufacture;

FIG. 15 is a cross-sectional view of the semiconductor component of FIG. 14 at a later stage of manufacture;

FIG. 16 is a cross-sectional view of a semiconductor component of FIG. 17 taken along section line 19-19 of FIG. 17, but at an earlier stage of manufacture;

FIG. 17 is a top view of the semiconductor component of FIGS. 16, 18, and 19;

FIG. 18 is a cross-sectional view of the semiconductor component of FIG. 17 taken along section line 18-18;

FIG. 19 is a cross-sectional view of the semiconductor component of FIG. 17 taken along section line 19-19;

FIG. 20 is a cross-sectional view of the semiconductor component of FIG. 18 at a later stage of manufacture;

FIG. 21 is a cross-sectional view of the semiconductor component of FIG. 19 at a later stage of manufacture;

FIG. 22 is a cross-sectional view of the semiconductor component of FIG. 20 at a later stage of manufacture;

FIG. 23 is a cross-sectional view of the semiconductor component of FIG. 22 at a later stage of manufacture;

FIG. 24 is a cross-sectional view of the semiconductor component of FIG. 22 at a different location and at a later stage of manufacture;

FIG. 25 is a cross-sectional view of the semiconductor component of FIG. 23 at a later stage of manufacture;

FIG. 26 is a cross-sectional view of the semiconductor component of FIG. 24 at a different location and at a later stage of manufacture;

FIG. 27 is a top view of the semiconductor components of FIGS. 25 and 26;

FIG. 28 is a cross-sectional view taken along section line 31-31 of FIG. 30 but at an earlier stage of manufacture;

FIG. 29 is a cross-sectional view taken along section line 32-32 of FIG. 30 but at an earlier stage of manufacture;

FIG. 30 is a top view of the semiconductor component of FIGS. 28 and 29 at a later stage of manufacture;

FIG. 31 is a cross-sectional view taken along section line 31-31 of FIG. 30;

FIG. 32 is a cross-sectional view taken along section line 32-32 of FIG. 30;

FIG. 33 is a top view of the semiconductor component of FIGS. 31 and 32 at a later stage of manufacture;

FIG. 34 is a top view of a semiconductor component in accordance with another embodiment of the present invention;

FIG. 35 is a cross-sectional view of the semiconductor component of FIG. 34 taken along section line 35-35 of FIG. 34 but at an earlier stage of manufacture;

FIG. 36 is a cross-sectional view of the semiconductor component of FIG. 34 taken along section line 36-36 of FIG. 34 but at an earlier stage of manufacture;

FIG. 37 is a cross-sectional view of the semiconductor component of FIG. 35 at a later stage of manufacture;

FIG. 38 is a cross-sectional view of the semiconductor component of FIG. 36 at a later stage of manufacture;

FIG. 39 is a cross-sectional view of the semiconductor component of FIG. 37 at a later stage of manufacture;

FIG. 40 is a cross-sectional view of the semiconductor component of FIG. 38 at a later stage of manufacture;

FIG. 41 is a cross-sectional view of the semiconductor component of FIG. 39 at a later stage of manufacture;

FIG. 42 is a cross-sectional view of the semiconductor component of FIG. 40 at a later stage of manufacture;

FIG. 43 is a cross-sectional view of the semiconductor component of FIG. 41 at a later stage of manufacture; and

FIG. 44 is a cross-sectional view of the semiconductor component of FIG. 42 at a later stage of manufacture.

For simplicity and clarity of the illustration, elements in the figures are not necessarily to scale, and the same reference characters in different figures denote the same elements. Additionally, descriptions and details of well-known steps and elements are omitted for simplicity of the description. As used herein current carrying electrode means an element of a device that carries current through the device such as a source or a drain of an MOS transistor or an emitter or a collector of a bipolar transistor or a cathode or an anode of a diode, and a control electrode means an element of the device that controls current flow through the device such as a gate of an MOS transistor or a base of a bipolar transistor. Although the devices are explained herein as certain N-channel or P-Channel devices, or certain N-type of P-type doped regions, a person of ordinary skill in the art will appreciate that complementary devices are also possible in accordance with embodiments of the present invention. It will be appreciated by those skilled in the art that the words during, while, and when as used herein are not exact terms that mean an action takes place instantly upon an initiating action but that there may be some small but reasonable delay, such as a propagation delay, between the reaction that is initiated by the initial action. The use of the word approximately or substantially means that a value of element has a parameter that is expected to be very close to a stated value or position. However, as is well known in the art there are always minor variances that prevent the values or positions from being exactly as stated. It is well established in the art that variances of up to about ten percent (10%) (and up to twenty percent (20%) for semiconductor doping concentrations) are regarded as reasonable variances from the ideal goal of exactly as described. For clarity of the drawings, doped regions of device structures are illustrated as having generally straight line edges and precise angular corners. However, those skilled in the art understand that due to the diffusion and activation of dopants the edges of doped regions generally may not be straight lines and the corners may not be precise angles.

DETAILED DESCRIPTION

FIG. 1 is a cross-sectional view of an integrated common mode choke 10 at a beginning stage of manufacture in accordance with an embodiment of the present invention. What is shown in FIG. 1 is a semiconductor material 12 having a major surface 14. In accordance with an embodiment, semiconductor material 12 is silicon doped with an impurity material of P-type conductivity such as, for example, boron. By way of example, the resistivity of semiconductor material 12 ranges from about 0.001 Ohm-centimeters (Ω-cm) to about 10,000 Ω-cm. Although semiconductor material 12 may be a high resistivity substrate, the resistivity or dopant concentration of semiconductor material 12 is not a limitation. Likewise, semiconductor 12 is not limited to being a silicon substrate and the conductivity type of substrate 12 is not limited to being P-type conductivity. It should be understood that an impurity material is also referred to as a dopant or impurity species. Other suitable materials for substrate 12 include polysilicon, germanium, silicon germanium, Semiconductor-On-Insulator (“SOI”) material, an epitaxial layer formed on a bulk silicon material, and the like. In addition, substrate 12 can be comprised of a compound semiconductor material such as Group III-V semiconductor materials, Group II-VI semiconductor materials, etc.

Optionally, a transient voltage suppression structure 16 may be formed from substrate 12.

A layer of dielectric material 18 having a thickness ranging from about 1,000 Angstroms (Å) to about 60,000 Å is formed on surface 14. In accordance with an embodiment, dielectric material 18 is formed by the decomposition of tetraethylorthosilicate (“TEOS”) to form an oxide layer having a thickness of about 8,000 Å. A dielectric layer formed in this manner is typically referred to as TEOS or a TEOS layer. The type of material for dielectric layer 18 is not a limitation of the present invention. A layer of photoresist is formed on TEOS layer 18 and patterned to have openings 20 and 22 that expose portions of TEOS layer 18. The remaining portions of the photoresist layer serve as a masking structure 24.

Referring now to FIG. 2, openings are formed in the exposed portions of dielectric layer 18 using, for example, an anisotropic reactive ion etch. The openings expose portions of transient voltage suppression structures 16 formed in semiconductor substrate 12 and portion 26 of substrate 12. Masking structure 24 is removed. A layer of refractory metal (not shown) is conformally deposited over the exposed portions of transient voltage suppression structures 16, portion 26 of substrate 12, and over dielectric layer 18. By way of example, the refractory metal is nickel, having a thickness ranging from about 50 Å to about 150 Å. The refractory metal is heated to a temperature ranging from about 350 degrees Celsius (° C.) to about 500° C. The heat treatment causes the nickel to react with the silicon to form nickel silicide (NiSi) in all regions in which the nickel is in contact with silicon. Thus, nickel silicide regions 28 are formed from portions of transient voltage suppression structures 16 and a nickel silicide region 30 is formed from portion 26 of substrate 12. The portions of the nickel over dielectric layer 18 remain unreacted. After formation of the nickel silicide regions, any unreacted nickel is removed. It should be understood that the type of silicide is not a limitation of the present invention. For example, other suitable silicides include titanium silicide (TiSi), platinum silicide (PtSi), cobalt silicide (CoSi₂), or the like. As those skilled in the art are aware, silicon is consumed during the silicide formation and the amount of silicon consumed is a function of the type of silicide being formed.

Referring now to FIG. 3, layer of titanium 32 having a thickness ranging from about 25 Å to about 200 Å is formed on dielectric layer 18 and in the openings formed in dielectric layer 18. A layer of titanium nitride 34 having a thickness ranging from about 75 Å to about 600 Å is formed on titanium layer 32. A layer of aluminum 36 having thickness ranging from about 5,000 Å to about 40,000 Å is formed on titanium nitride layer 34. By way of example aluminum layer 36 has a thickness of about 20,000 Å. A layer of titanium nitride 38 having a thickness ranging from about 400 Å to about 900 Å is formed on aluminum layer 36. Layers 32, 34, 36, and 38 may be formed using Chemical Vapor Deposition (“CVD”), Plasma Enhanced Chemical Vapor Deposition (“PECVD”), sputtering, evaporation, or the like. It should be understood that the materials of layers 32, 34, and 36 are not limitations of the present invention. Other suitable materials for layer 32 include tantalum, tungsten, platinum, a refractory metal compound, a refractory metal carbide, a refractory metal boride, or the like. Other suitable materials for layer 34 include, tantalum nitride, a metal nitride doped with carbon, a metal nitride doped with silicon, or the like. Other suitable materials for layer 36 include gold, silver, an aluminum alloy, or the like.

A layer of photoresist is formed on titanium nitride layer 38 and patterned to have openings 40 that expose portions of titanium nitride layer 38. The remaining portions of the photoresist layer serve as a masking structure 42.

Referring now to FIG. 4, the exposed portions of titanium nitride layer 38 and the portions of layers 36, 34, and 32 under the exposed portions of titanium nitride layer 38 are anisotropically etched using, for example, a reactive ion etch. Dielectric layer 18 serves as an etch stop layer. After anisotropically etching layers 38, 36, 34, and 32, contacts 46 remain that are in contact with transient voltage suppression regions 16, and a contact 48 remains in contact with, for example, an active device formed from substrate 12. For the sake of clarity, contacts 46 and 48 are shown as being comprised of a single material. However, it should be understood that contacts 46 and 48 are comprised of portions of layers 32-38.

A passivation layer 50 having a thickness ranging from about 0.1 micrometers (μm) to about 3 μm is formed on dielectric layer 18 and contacts 46 and 48. Suitable materials for passivation layer 50 include silicon oxide, silicon nitride, or the like. A layer of dielectric material 52 having a thickness ranging from about 1 μm to about 20 μm is formed on passivation layer 50. By way of example, layer 52 is a TEOS layer. A seed layer 54 having a thickness ranging from about 100 Å to about 1 μm is formed on dielectric material 52. By way of example, seed layer 54 is a titanium copper layer. A layer of electrically conductive material 56 such as, for example, copper having a thickness ranging from about 1 μm to about 20 μm is formed on seed layer 54. A layer of photoresist is formed on copper layer 56 and patterned to have openings 58 that expose portions of copper layer 56. The remaining portions of the photoresist layer serve as a masking structure 60.

Referring now to FIG. 5, the exposed portions of electrically conductive layer 56 are anisotropically etched using, for example, a reactive ion etch and an etch chemistry that preferentially etches, for example, copper. The etch stops on dielectric layer 52. After the etch, portions 56A, 56B, 56C, and 56D of electrically conductive layer 56 remain forming a portion 62 of a coil or inductor 64. It should be noted that FIG. 5 is a cross-sectional view taken along section line 5-5 of FIG. 6 and that reference characters 56A₁, 56B₁, 56C₁, and 56D₁ are further described with reference to FIG. 6. Masking structure 60 is removed.

Referring now to FIG. 6, a top view of portions 56A, 56B, 56C, and 56D of inductor 64 is illustrated. Portion 56A includes end regions 56A₁ and 56A₂ and a body region 56A₃, portion 56B includes end regions 56B₁ and 56B₂ and a body region 56B₃, portion 56C includes end regions 56C₁ and 56C₂ and a body region 56C₃, and portion 56D includes end regions 56D₁ and 56D₂ and a body region 56D₃. It should be noted that in cross section end regions 56A₂, 56B₂, 56C₂, and 56D₂ look similar to end regions 56A₁, 56B₁, 56C₁, and 56D₁, respectively, shown in FIG. 5.

Referring now to FIG. 7, a layer of dielectric material 66 having a thickness ranging from about 2 μm to about 20 μm is formed on portions 56A, 56B, 56C, and 56D of coil 64 and on the exposed portions of TEOS layer 52. By way of example, layer 66 is a TEOS layer. A layer of photoresist is formed on dielectric layer 66 and patterned to have openings 68 that expose portions of dielectric layer 66. The remaining portions of the photoresist layer serve as a masking structure 70.

Referring now to FIGS. 8 and 9, the exposed portions of dielectric layer 66 are anisotropically etched using, for example, a reactive ion etch and an etch chemistry that preferentially etches the dielectric material of dielectric layer 66. It should be noted that FIGS. 8 and 9 are cross-sectional views taken along section lines 8-8 and 9-9, respectively, of FIG. 11, but at an earlier stage of manufacture. The etch forms openings 72 in dielectric layer 66. Openings 72 expose portions 56A-56D of coil 64. Masking structure 70 is removed. A barrier layer 74 is formed along the sidewalls of openings 72 and over the exposed portions of dielectric layer 66. By way of example, barrier layer 74 is titanium nitride. The material for barrier layer 74 is not a limitation of the present invention. A layer of electrically conductive material 76 is formed over barrier layer 74. Suitable materials for electrically conductive material 76 include copper, gold, silver, aluminum, an aluminum alloy, or the like.

A layer of photoresist is formed on electrically conductive layer 76 and patterned to have openings 78 that expose portions of electrically conductive layer 76. The remaining portions of the photoresist layer serve as a masking structure 80.

Referring now to FIG. 10, the exposed portions of electrically conductive layer 76 are anisotropically etched using, for example, a reactive ion etch and an etch chemistry that preferentially etches the material of electrically conductive layer 76, e.g., copper when layer 76 is copper. FIG. 10 is a cross-sectional view of semiconductor component 10 of FIG. 8 at a later stage. Thus, FIG. 10 is a cross-sectional view taken along section line 8-8 of FIG. 11. The etch stops on dielectric layer 66. After the etch, portions 76A₁, 76B₁, 76C₁, 76D₁, 76E₁, 76F₁, 76G₁, 76H₁, 76A₂, 76B₂, 76C₂, 76D₂, 76E₂, 76F₂, 76G₂, 76H₂, 76I, and 76J of electrically conductive layer 76 remain. Portions 76A₂, 76B₂, 76C₂, 76D₂, 76E₂, 76F₂, 76G₂, 76H₂ are illustrated with reference to FIG. 11. Portions 76A₁, 76B₁, 76C₁, and 76D₁ are over portions 56A₁, 56B₁, 56C₁, and 56D₁, respectively, and serve as contacts to coil 64. Portions 76E₁, 76F₁, 76G₁, and 76H₁ form a portion 82 of a coil or inductor 84. Masking structure 80 is removed. Portions 76I and 76H₁ serve as terminals for coil 84 and portions 76A₁ and 76J serve as terminals for coil 64. A layer of dielectric material 86 is formed on the exposed portions of dielectric material 66.

Referring now to FIG. 11, a top view of portions 56A, 56B, 56C, and 56D of coil 64 is illustrated as broken lines and portions 76E, 76F, 76G, and 76H of coil 84 are shown as solid lines. FIG. 11 further illustrates contacts 76A₁, 76B₁, 76C₁, and 76D₁, and terminals 76I and 76J that are illustrated in FIG. 10. In addition, FIG. 11 illustrates contacts 76A₂, 76B₂, 76C₂, and 76D₂ that are formed along with contacts 76A₁, 76B₁, 76C₁, and 76D₁. It should be noted that contacts 76A₁, 76B₁, 76C₁, 76D₁ contact one end of coil portions 56A, 56B, 56C, and 56D and interconnects 76A₂, 76B₂, 76C₂, 76D₂ contact an opposing end of coil portions 56A, 56B, 56C, and 56D, respectively. Similarly, FIG. 11 illustrates contact portions 76E₁, 76F₁, 76G₁, and 76H₁ and contact portions 76E₂, 76F₂, 76G₂, and 76H₂ that serve as contact portions of an opposing ends of coil portions 76E, 76F, 76G, and 76H, respectively.

Referring now to FIG. 12, terminal 76I is coupled to contact 76E₂ via a bonding wire 90, contact 76E₁ is coupled to contact 76F₂ via a bonding wire 92, contact 76F₁ is coupled to contact 76G₂ via a bonding wire 94, contact 76G₁ is coupled to contact 76H₂ via a bonding wire 96. Contact 76B₁ is coupled to contact 76A₂ via a bonding wire 100, contact 76C₁ is coupled to contact 76B₂ via a bonding wire 102, contact 76D₁ is coupled to contact 76C₂ via a bonding wire 104, and terminal 76J is coupled to contact 76D₂ via a bonding wire 106. Contact 76A₁ and terminal 76J serve as input and output terminals of a coil 64 and terminal 76I and contact 76H₁ serve as input and output terminals of a coil 84. Coils 64 and 84 cooperate to form a common mode choke.

FIG. 13 is a cross-sectional view of a semiconductor component 200 taken along section line 18-18 of FIG. 17, but at an earlier stage of manufacture, in accordance with another embodiment. What is shown in FIG. 13 is semiconductor material 12 having major surface 14. Semiconductor material 12 has been described with reference to FIG. 1. Transient voltage suppression structures 202 and 204 may be formed in or from semiconductor material 12. In addition, active devices (not shown) such as, for example, transistors, diodes, or the like and passive devices (not shown) such as, for example, resistors, capacitors, inductors, or the like may be formed in or from semiconductor material 12. A dielectric structure 206 is formed over semiconductor material 12. By way of example, dielectric structure 206 is a multi-layer dielectric structure comprising: a screen oxide layer 208 formed over or from semiconductor material 12, a reoxidation layer 210 formed on or from screen oxide layer 208, an undoped silicate glass (USG) layer 212 formed on reoxidation layer 210, and a boro-phospho silicate glass layer 214 formed over USG layer 212. It should be understood that the number of layers of insulating material, the thicknesses of the layers of insulating material, and the methods for forming the insulating layers of dielectric structure 206 are not limitations. Thus, dielectric structure 206 may be comprised of one, two, three, or more layers of dielectric material. A layer of photoresist is formed on dielectric layer 214 and patterned to have openings 216 and 218 that expose portions of dielectric layer 214 of dielectric structure 206. The remaining portions of the photoresist layer serve as a masking structure 220.

Referring now to FIG. 14, the portions of dielectric structure 206 exposed by openings 216 and 218 are removed using, for example, an anisotropic reactive ion etch to expose portions of transient voltage suppression devices 202 and 204. An electrically conductive barrier structure 222 having a thickness ranging from about 1,000 Å to about 10,000 Å is formed along the exposed portions of dielectric layers 208-214 and on the exposed portions of semiconductor material 12 in which transient voltage suppression devices 202 and 204 are formed. By way of example, electrically conductive barrier structure 222 is comprised of a layer of titanium nitride 224 formed on the exposed portions of dielectric layers 208-214 and semiconductor material 12 and a layer of titanium 226 formed on titanium nitride layer 224. Suitable techniques for forming titanium nitride layer 224 and titanium layer 226 include sputtering, Chemical Vapor Deposition (CVD), Plasma Enhanced Chemical Vapor Deposition (PECVD, evaporation, or the like. The material for layers 224 and 226 are not limited to being titanium nitride and titanium, respectively. Other suitable materials for layer 224 include tantalum nitride, tungsten nitride, or the like, and other suitable materials for layer 226 include tantalum, a combination of tantalum and tantalum nitride, tungsten, refractory metal compounds such as, for example, refractory metal nitrides, refractory metal carbides, refractory metal borides, or the like.

A layer of electrically conductive material 228 such as for example, aluminum is formed on titanium nitride layer 226. Techniques for forming aluminum layer 228 include sputtering, evaporation, plasma deposition, or the like. Electrically conductive layer 228 is not limited to being aluminum. Other suitable electrically conductive materials for layer 228 include copper, nickel, or the like. A layer of photoresist is formed on aluminum layer 228 and patterned to have one or more openings 230 that expose one or more portions of aluminum layer 228. The remaining portions of the photoresist layer serve as a masking structure 232.

Referring now to FIG. 15, the exposed portion or portions of aluminum layer 228 and the portions of titanium nitride layer 226 and titanium layer 224 that are below the exposed portion or portions of aluminum layer 228 are anisotropically etched using, for example, a reactive ion etch and etch chemistries suitable for etching aluminum, titanium, and titanium nitride. It should be noted that FIG. 15 is a cross-sectional view of semiconductor component 200 taken along section line 18-18 of FIG. 17, but at an earlier stage of manufacture. Etching the exposed portion of aluminum layer 228 and the portions of titanium nitride layer 226 and titanium layer 224 that are below the exposed portion of aluminum layer 228 exposes a portion of dielectric structure 206. Thus, the etch forms a contact structure 234 that electrically contacts transient voltage suppression device 202 and a contact structure 236 that electrically contacts transient voltage suppression device 204. Masking structure 232 is removed.

Still referring to FIG. 15, a passivation layer 238 is formed on or over electrical contact structures 234 and 236 and on the exposed portion of dielectric structure 206. By way of example, passivation layer 238 is silicon nitride (Si₃N₄). Other suitable materials for passivation layer 238 include silicon dioxide, or the like. A passivation layer 240 having a thickness ranging from about 2 μm to about 20 μm is formed on passivation layer 238. By way of example, passivation layer 240 is polyimide. A layer of photoresist (not shown) is formed on passivation layer 240 and patterned to have openings that expose portions of passivation layer 240 that are over transient voltage suppression devices 202 and 204. The remaining portions of the photoresist layer serve as a masking structure.

The exposed portions of passivation layer 240 and the portions of passivation layer 238 that are between the exposed portions of passivation layer 240 and transient voltage suppression devices 202 and 204 are anisotropically etched to expose portions of contact structures 234 and 236. The masking structure is removed. An electrically conductive barrier structure 241 having a thickness ranging from about 0.1 μm to about 1 μm is formed along the exposed portions of passivation layers 226 and 228 and on the exposed portions of contact structures 234 and 236. By way of example, the electrically conductive barrier structure is comprised of a layer of titanium nitride 242 formed on the exposed portions of passivation layers 238 and 240 and the exposed portions of contact structures 234 and 236 and a layer of titanium 244 is formed on titanium nitride layer 242. Suitable techniques for forming titanium nitride layer 242 and titanium layer 244 include sputtering, Chemical Vapor Deposition (CVD), Plasma Enhanced Chemical Vapor Deposition (PECVD), evaporation, or the like. The material for layers 242 and 244 are not limited to being titanium nitride and titanium, respectively. Other suitable materials for layer 242 include tantalum nitride, tungsten nitride, or the like, and other suitable materials for layer 244 include tantalum, a combination of tantalum and tantalum nitride, tungsten, refractory metal compounds such as, for example, refractory metal nitrides, refractory metal carbides, refractory metal borides, or the like. A layer of photoresist is formed on titanium layer 244 and patterned to have openings 246A, 246B, 246C, 246D, and 247 that expose portions of titanium layer 244. The remaining portions of the photoresist layer serve as a masking structure 248.

FIG. 16 is a cross-sectional view taken along section line 19-19 of FIG. 17 but at an earlier stage of manufacture. What is shown in FIG. 16 is a portion of semiconductor component 200 in which contact structures are absent. More particularly, FIG. 16 illustrates dielectric structure 206, passivation layers 238 and 240, barrier structure 241, openings 246A-246D, and portions of masking structure 248. It should be noted that FIGS. 15 and 16 represent the same stage of the manufacture of semiconductor component 200, but at different locations.

Referring now to FIG. 17, an electrically conductive material is formed on the exposed portions of titanium nitride layer 244 in openings 246A, 246B, 246C, 246D, and 247 to form electrically conductive strips 252A, 252B, 252C, and 252D, respectively. It should be noted that FIG. 17 is a top view of semiconductor component 200 that further illustrates the regions through which section lines 18-18 and 19-19 are taken and that reference characters “A,” “B,” “C,” and “D” have been appended to reference character 246 to distinguish in which openings the electrically conductive material is formed. Electrically conductive strip 252A has ends 252A₁ and 252A₂ and a body 252A₃, electrically conductive strip 252B has ends 252B₁ and 252B₂ and a body 252B₃, electrically conductive strip 252C has ends 252C₁ and 252C₂ and a body 252C₃, and electrically conductive strip 252D has ends 252D₁ and 252D₂ and a body 252D₃. By way of example, the electrically conductive material is copper formed using an electroplating technique. The technique for forming electrically conductive strips 252A, 252B, 252C, and 252D, the electrically conductive material of electrically conductive strips 252A, 252B, 252C, and 252D, and the number of electrically conductive strips that are formed are not limitations. Other suitable techniques for forming electrically conductive strips 252A, 252B, 252C, and 252D include sputtering, evaporation, wet-etching, dry-etching, or the like and other suitable materials for electrically conductive strips 252A, 252B, 252C, and 252D include gold, aluminum, silver, or the like. It should be noted that electrically conductive strips 252A, 252B, 252C, and 252D serve as portions or elements of a coil or inductor.

FIG. 18 is a cross-sectional view of semiconductor component 200 taken along section line 18-18 of FIG. 17. FIG. 18 further illustrates ends 252A₁, 252B₁, 252C₁, and 252D₁, and a contact extension 253 formed on titanium layer 244.

FIG. 19 is a cross-sectional view of semiconductor component 200 taken along section line 19-19 of FIG. 17. What is shown in FIG. 19 are portions of dielectric structure 206, passivation layers 238 and 240, barrier structure 241, and electrically conductive strips 252A, 252B, 252C, and 252D, respectively. It should be noted that FIGS. 18 and 19 represent the same stage of the manufacture of semiconductor component 200, but at different locations.

FIGS. 20 and 21 are cross-sectional views of semiconductor component 200 of FIGS. 18 and 19, respectively, taken at a subsequent step. What is shown in FIGS. 20 and 21 is semiconductor component 200 after the removal of masking structure 248. It should be noted that the top view of semiconductor component 200 at the processing step illustrated by FIGS. 20 and 21 looks similar to that of FIG. 17. It should be noted that FIGS. 20 and 21 represent the same stage of the manufacture of semiconductor component 200, but at different locations.

FIG. 22 is a cross-sectional view of semiconductor component 200 of FIG. 20 at a later stage of manufacture. What is shown in FIG. 22 is semiconductor component 200 after the removal of the portions of electrically conductive layers 244 and 242 that were exposed by the removal of masking structure 248. It should be noted that the top view of semiconductor component 200 at the processing step illustrated by FIG. 22 looks similar to that of FIG. 17.

Referring now to FIGS. 23 and 24, a passivation layer 260 is formed on or over electrically conductive strips 252A, 252B, 252C, and 252D and on the exposed portions of passivation layer 240. It should be noted that FIGS. 23 and 24 represent the same stage of the manufacture of semiconductor component 200, but at different locations. By way of example, passivation layer 260 is polyimide. Other suitable materials for passivation layer 260 include silicon dioxide, silicon nitride, or the like. A layer of photoresist (not shown) is formed on polyimide layer 260 and patterned to have openings 262A, 262B, 262C, and 262D that expose portions of polyimide layer 260 that are over end portions 252A₁, 252B₁, 252C₁, and 252D₁ and over end portions 252A₂, 252B₂, 252C₂, and 252D₂, respectively, and an opening 263 over contact extension 253. The remaining portions of the photoresist layer serve as a masking structure 266.

Referring now to FIGS. 25 and 26, the exposed portions of polyimide layer 260 are anisotropically etched to expose end portions 252A₁, 252B₁, 252C₁, and 252D₁ of electrically conductive strips 252A, 252B, 252C, and 252D, respectively, end portions 252A₂, 252B₂, 252C₂, and 252D₂ (not shown in FIGS. 25 and 26) of electrically conductive strips 252A, 252B, 252C, and 252D, respectively, and contact extension 253. The masking structure is removed. An electrically conductive barrier structure 270 having a thickness ranging from about 0.1 μm to about 1 μm is formed along the exposed portions of passivation layer 260 and on end portions 252A₁, 252B₁, 252C₁, and 252D₁ and end portions 252A₂, 252B₂, 252C₂, and 252D₂ of electrically conductive strips 252A, 252B, 252C, and 252D, respectively, and on contact extension 253. By way of example, electrically conductive barrier structure 270 is comprised of a layer of titanium nitride 272 and a layer of titanium 274, where the titanium nitride layer is formed on the exposed portions of passivation layer 260, the exposed portions of end portions 252A₁, 252B₁, 252C₁, and 252D₁ and 252A₂, 252B₂, 252C₂, and 252D₂ of electrically conductive strips 252A, 252B, 252C, and 252D, respectively, and on contact extension 253. Titanium layer 274 is formed on titanium nitride layer 272. Suitable techniques for forming titanium nitride layer 272 and titanium layer 274 include sputtering, Chemical Vapor Deposition (CVD), Plasma Enhanced Chemical Vapor Deposition (PECVD, evaporation, or the like. The material for layers 272 and 274 are not limited to being titanium nitride and titanium, respectively. Other suitable materials for layer 272 include tantalum nitride, tungsten nitride, or the like, and other suitable materials for layer 274 include tantalum, a combination of tantalum and tantalum nitride, tungsten, refractory metal compounds such as, for example, refractory metal nitrides, refractory metal carbides, refractory metal borides, or the like.

A layer of photoresist is formed on titanium layer 274 and patterned to have openings (not shown) that expose portions of barrier layer 270 on end portions 252A₁, 252B₁, 252C₁, 252D₁, 252A₂, 252B₂, 252C₂, and 252D₂ of electrically conductive strips 252A, 252B, 252C, and 252D, respectively, and contact extension 253. In addition, openings are formed to expose portions of barrier layer 270 that are on the portions of polyimide layer 260 that are between electrically conductive strips 252A and 252B, the portions of barrier layer 270 that are on the portions of polyimide layer 260 that are between electrically conductive strips 252B and 252C, the portions of barrier layer 270 that are on the portions of polyimide layer 260 that are between electrically conductive strips 252C and 252D, and the portions of barrier layer 270 that are on the portions of polyimide layer 260 that are laterally adjacent to electrically conductive strip 252D. The remaining portions of the photoresist layer serve as a masking structure 278.

Briefly referring to FIG. 27, an electrically conductive material formed on the exposed portions of titanium nitride layer 274 to form electrically conductive strips 282A, 282B, 282C, and 282D, respectively, is shown. It should be noted that FIG. 27 is a top view of semiconductor component 200 that further illustrates the regions through which section lines 28-28 and 29-29 are taken and that reference characters “A,” “B,” “C,” and “D” have been appended to reference character 282 to distinguish the electrically conductive strips. Electrically conductive strip 282A has ends 282A₁ and 282A₂ and a body 282A₃, electrically conductive strip 282B has ends 282B₁ and 282B₂ and a body 282B₃, electrically conductive strip 282C has ends 282C₁ and 282C₂ and a body 282C₃, and electrically conductive strip 282D has ends 282D₁ and 282D₂ and a body 282D₃. By way of example, the electrically conductive material is copper formed using an electroplating technique. The technique for forming electrically conductive strips 282A, 282B, 282C, and 282D, the electrically conductive material of electrically conductive strips 282A, 282B, 282C, and 282D, and the number of electrically conductive strips that are formed are not limitations. Other suitable materials for electrically conductive strips 282A, 282B, 282C, and 282D include aluminum, gold, silver, or the like. It should be noted that electrically conductive strips 282A, 282B, 282C, and 282D serve as portions or elements of a coil or inductor.

Referring again to FIGS. 25 and 26, cross-sectional views of end portions 282A₁, 282B₁, 282C₁, and 282D₁, contact portions 290A₁, 290B₁, 290C₁, and 290D₁, and body portions 282A₃, 282B₃, 282C₃, and 282D₃ are illustrated. It should be noted that a top view of end portions 282A₁, 282B₁, 282C₁, and 282D₁, contact portions 290A₁, 290B₁, 290C₁, and 290D₁, and body portions 282A₃, 282B₃, 282C₃, and 282D₃ are shown in FIG. 27.

Referring now to FIGS. 28 and 29, masking structure 278 is removed and a passivation layer 300 is formed on or over contact portions 290A₁, 290B₁, 290C₁, and 290D₁, electrically conductive strips 282A, 282B, 282C, and 282D, and the exposed portions of polyimide layer 260. By way of example, passivation layer 300 is polyimide. Other suitable materials for passivation layer 300 include silicon dioxide, silicon nitride, or the like. A layer of photoresist (not shown) is formed on polyimide layer 300 and patterned to have openings that expose the portions of polyimide layer 300 that are over contact portions 290A₁, 290B₁, 290C₁, and 290D₁ and over contact portions 290A₂, 290B₂, 290C₂, and 290D₂ (shown in FIG. 27) and openings over end portions 282A₁, 282B₁, 282C₁, and 282D₁ and end portions 282A₂, 282B₂, 282C₂, and 282D₂ (shown in FIG. 27) of electrically conductive strips 282A, 282B, 282C, and 282D, respectively. The remaining portions of the photoresist layer serve as a masking structure. It should be noted that FIGS. 28 and 29 are cross-sectional views taken along section lines 31-31 and 32-32 of FIG. 30, but at an earlier stage of manufacture.

Still referring to FIGS. 28 and 29, the exposed portions of polyimide layer 300 are anisotropically etched to expose contact portions 290A₁, 290B₁, 290C₁, and 290D₁, contact portions 290A₂, 290B₂, 290C₂, and 290D₂, and end portions 282A₁, 282B₁, 282C₁, and 282D₁ and end portions 282A₂, 282B₂, 282C₂, and 282D₂ of electrically conductive strips 282A, 282B, 282C, and 282D, respectively. The masking structure is removed. An electrically conductive barrier structure 302 is formed along the exposed portions of passivation layer 300 and on the exposed portions of contact portions 290A₁, 290B₁, 290C₁, and 290D₁, contact portions 290A₂, 290B₂, 290C₂, and 290D₂, end portions 282A₁, 282B₁, 282C₁, and 282D₁, and end portions 282A₂, 282B₂, 282C₂, and 282D₂. By way of example, the electrically conductive barrier structure is comprised of a layer of titanium nitride 304 and a layer of titanium 306, where titanium nitride layer 304 is formed on passivation layer 300, the exposed portions of contact portions 290A₁, 290B₁, 290C₁, and 290D₁, contact portions 290A₂, 290B₂, 290C₂, and 290D₂, end portions 282A₁, 282B₁, 282C₁, and 282D₁ and end portions 282A₂, 282B₂, 282C₂, and 282D₂. Titanium layer 306 is formed on titanium nitride layer 304. Suitable techniques for forming titanium nitride layer 304 and titanium layer 306 include sputtering, Chemical Vapor Deposition (CVD), Plasma Enhanced Chemical Vapor Deposition (PECVD, evaporation, or the like. The material for layers 304 and 306 are not limited to being titanium nitride and titanium, respectively. Other suitable materials for layer 304 include tantalum nitride, tungsten nitride, or the like, and other suitable materials for layer 306 include tantalum, a combination of tantalum and tantalum nitride, tungsten, refractory metal compounds such as, for example, refractory metal nitrides, refractory metal carbides, refractory metal borides, or the like.

A layer of photoresist is formed on titanium layer 306 and patterned to have openings (not shown) that expose portions of barrier structure 302 on contact portions 290A₁, 290B₁, 290C₁, 290D₁, 290A₂, 290B₂, 290C₂, and 290D₂, and end portions 282A₁, 282B₁, 282C₁, 282D₁, 282A₂, 282B₂, 282C₂, and 282D₂ of electrically conductive strips 282A, 282B, 282C, and 282D, respectively. In addition, openings are formed to expose portions of barrier structure 302 that are on the portions of polyimide layer 300 that are between contact portions 290A₁ and 290B₁, between contact portions 290B₁ and 290C₁, between contact portions 290C₁ and 290D₁, and on the portion of polyimide layer laterally adjacent contact portion 290D₁. The remaining portions of the photoresist layer serve as a masking structure 310.

An electrically conductive material is formed on the exposed portions of barrier structure 302 to form contacts 312A₁, 312B₁, 312C₁, 312D₁, 314A₁, 314B₁, 314C₁, 314D₁, and terminals 316 and 318. It should be noted that contact 312A₁ includes contact portions 290A₁ and 252A₁, contact 312B₁ includes contact portions 290B₁ and 252B₁, contact 312C₁ includes contact portions 290C₁ and 252C₁, contact 312D₁ includes contact portions 290D₁ and 252D₁. It should be further understood that contacts 312A₂, 312B₂, 312C₂, 312D₂, 314A₂, 314B₂, 314C₂, and 314D₂ shown in FIG. 30 have similar structures to contacts 312A₁, 312B₁, 312C₁, 312D₁, 314A₁, 314B₁, 314C₁, 314D₁.

FIG. 30 is a top view of semiconductor component 200 after removal of masking structure 310 and the portions of barrier structure 302 exposed by the removal of masking structure 310. What is shown in FIG. 30 are electrically conductive strips 282A, 282B, 282C, and 282D including end portions 282A₁, 282B₁, 282C₁, 282D₁, 282A₂, 282B₂, 282C₂, and 282D₂ and body portions 282A₃, 282B₃, 282C₃, 282D₃, contacts 312A₁, 312B₁, 312C₁, 312D₁, 312A₂, 312B₂, 312C₂, and 312D₂, 314A₁, 314B₁, 314C₁, 314D₁, 314A₂, 314B₂, 314C₂, and 314D₂, and terminals 316 and 318. In addition, FIG. 30 illustrates electrically conductive strips 252A, 252B, 252C, and 252D as broken lines.

FIGS. 31 and 32 are cross-sectional views of semiconductor component 200 taken along section lines 31-31 and 32-32 of FIG. 30. The descriptions of FIGS. 31 and 32 follows from those of FIGS. 28 and 29, respectively. Masking structure 310 is removed and the portions of barrier structure 302 exposed by the removal of masking structure 310 are removed using, for example, an anisotropic reactive ion etch.

Referring now to FIG. 33, terminal 316 is coupled to contact 314A₂ via a bonding wire 330, contact 314A₁ is coupled to contact 314B₂ via a bonding wire 332, contact 314B₁ is coupled to contact 314C₂ via bonding wire 334, contact 314C₁ is coupled to contact 314D₂ via a bonding wire 336. Contact 312B₁ is coupled to contact 312A₂ via a bonding wire 340, contact 312C₁ is coupled to contact 312B₂ via a bonding wire 342, contact 312D₁ is coupled to contact 312C₂ via a bonding wire 344, and terminal 318 is coupled to contact 312D₂ via a bonding wire 346. Contact 312A₁ and terminal 318 serve as input and output terminals of a coil 320 and terminal 316 and contact 314D₁ serve as input and output terminals of a coil 322. Coils 320 and 322 cooperate to form a common mode choke. Bonding wires are also referred to as wirebonds.

FIG. 34 is a top view of a semiconductor component 400 in accordance with another embodiment of the present invention. What is shown in FIG. 34 is a top view of a common mode choke 402 comprising a coil 404 having terminals 406 and 408 and a coil 410 having terminals 412 and 414. Terminals 406 and 408 are coupled to bond pads 416 and 418 though interconnects 426 and 428, respectively, and terminals 412 and 414 are coupled to bond pads 422 and 424 through interconnects 430 and 432, respectively. FIG. 34 further shows transient voltage suppression devices 436 and 438 coupled to terminals 408 and 414 through interconnects 428 and 432, respectively. In addition, transient voltage suppression devices (not shown) may be coupled to terminals 406 and 412. Alternatively, transient voltage suppression devices may be coupled to terminals 406 and 412 rather than to terminals 408 and 414.

FIG. 35 is a cross-sectional view of a portion of semiconductor component 400 taken along section line 35-35 of FIG. 34, but at an earlier stage of manufacture in accordance with another embodiment of the present invention. What is shown in FIG. 35 is semiconductor material 12 having major surface 14. Semiconductor material 12 has been described with reference to FIG. 1. In addition, FIG. 35 illustrates a transient voltage suppression device, a dielectric structure 206, electrically conductive layers 224, 226, and 228, and a passivation layer 238, which have been described with reference to FIGS. 13 and 14. The transient voltage suppression device is identified by reference character 438 and may be similar to transient voltage suppression device 202 described with reference to FIGS. 13 and 14. Electrically conductive layers 224, 226, and 228 have been etched to form interconnect structures 430 and 432. Typically transient voltage suppression device 438 is connected to interconnect structure 432 through an electrical interconnect (not shown). A layer of photoresist is formed on passivation layer 238 and patterned to have openings 454 and 456 that expose portions of passivation layer 238. The remaining portions of the photoresist layer serve as a masking structure 458.

FIG. 36 is a cross-sectional view of a portion of semiconductor component 400 taken along section line 36-36 of FIG. 34, but at an earlier stage of manufacture. FIG. 36 further illustrates openings 460 and 462 formed in the layer of photoresist described in FIG. 35. It should be noted that in accordance with the alternative embodiment, openings such as openings 460 and 462 are formed in passivation layer 238 because it is a photosensitive material and assumes the function of the photoresist layer and masking structure 458. A transient voltage suppression device 436 is illustrated in FIG. 36 and may be similar to transient voltage suppression device 202 described with reference to FIGS. 13 and 14. Electrically conductive layers 224, 226, and 228 have been etched to form interconnect structures 453 and 455. Typically transient voltage suppression device 436 is connected to interconnect structure 453 through an electrical interconnect (not shown). It should be noted that FIGS. 35 and 36 represent the same stage of the manufacture of semiconductor component 400, but at different locations. FIG. 36 illustrates transient voltage suppression device 436.

FIGS. 37 and 38 are cross-sectional views of semiconductor component 400 of FIGS. 35 and 36, respectively, at a later stage of manufacture. Openings are formed in passivation layer 238 to expose portions of interconnect structures 450 and 452 and a polyimide layer 240 is formed over passivation layer 238 and in the openings that expose the portions of interconnect structures 450 and 452. Openings are formed in polyimide layer 240 to re-expose the portions of interconnect structures 450 and 452. An electrically conductive barrier structure 241 is formed over polyimide layer 240 and in the openings exposing interconnect structures 450 and 452. Techniques for forming polyimide layer 240, openings in polyimide layer 240, and electrically conductive barrier structure 241 have been described with reference to FIG. 15. A layer of photoresist is formed on polyimide layer 240 and patterned to have openings 466 that expose portions of polyimide layer 240. The remaining portions of the photoresist layer serve as a masking structure 468. Alternatively, passivation layer 240 may be comprised of a photosensitive material that can be patterned like photoresist to form a masking structure. In this alternative embodiment, the photoresist and masking structure 468 would be absent because their function may be realized by passivation layer 240.

FIGS. 39 and 40 are cross-sectional views of semiconductor component 400 of FIGS. 37 and 38, respectively, at a later stage of manufacture. A layer of electrically conductive material such as, for example, copper is formed in openings 466 to form coils 470 and contacts 472, 474, 476, and 478. Techniques for forming coils 470 and contacts 472, 474, 476, and 478 are similar to those for forming electrically conductive strips 252A-252D discussed with reference to FIGS. 17-19.

Referring now to FIGS. 41 and 42, cross-sectional views of semiconductor component 400 of FIGS. 39 and 40, respectively, at a later stage of manufacture are illustrated. The portions of electrically conductive barrier structure 241 exposed by the removal of the photoresist layer are anisotropically etched to expose portions of polyimide layer 240. A polyimide layer 260 is formed on coils 470, contacts 472, 474, 476, and 478, and on the exposed portions of polyimide layer 240. Formation of polyimide layer 260 is described with reference to FIGS. 23 and 24.

FIGS. 43 and 44 are cross-sectional views of semiconductor component 400 of FIGS. 41 and 42, respectively, taken at a later stage of manufacture. Coils 480 are formed over polyimide layer 260 using techniques similar to those described for forming electrically conductive strips 282A-282D with reference to FIGS. 25 and 26. In addition, contacts 482 and 484 are formed to be in contact with contacts 476 and 478, respectively. A passivation layer 486 is formed over passivation layer 260, coils 470 and 480, and contacts 472, 474, 476, and 478. By way of example, passivation layer 486 is polyimide.

Although certain preferred embodiments and methods have been disclosed herein, it will be apparent from the foregoing disclosure to those skilled in the art that variations and modifications of such embodiments and methods may be made without departing from the spirit and scope of the invention. It is intended that the invention shall be limited only to the extent required by the appended claims and the rules and principles of applicable law. 

1. A semiconductor component, comprising: a first electrically conductive structure having first and second ends and a body region between the first and second ends; a second electrically conductive structure having first and second ends and a body region between the first and second ends, the second electrically conductive structure vertically spaced apart from the first electrically conductive structure and a first portion of the body region of the second electrically conductive structure over a first portion of the body region of the first electrically conductive structure; a first bond wire having first and second ends, wherein the first end of the first bond wire is electrically coupled to the first end of the first electrically conductive structure; and a second bond wire having first and second ends, wherein the first end of the second bond wire is electrically coupled to the first end of the second electrically conductive structure.
 2. The semiconductor component of claim 1, wherein the first ends of the first and second electrically conductive structures are adjacent to each other.
 3. The semiconductor component of claim 1, further including a third electrically conductive structure having first and second ends and a body region between the first and second ends, wherein a second end of the first bond wire is electrically coupled to the second end of the third electrically conductive structure.
 4. The semiconductor component of claim 3, further including a fourth electrically conductive structure having first and second ends and a body region between the first and second ends, the fourth electrically conductive structure vertically spaced apart from the first electrically conductive structure and a second portion of the body region of the fourth electrically conductive structure over a second portion of the body region of the first electrically conductive structure, the second end of the third electrically conductive structure laterally between the second ends of the second and the fourth electrically conductive structure, and the second end of the second bond wire electrically coupled to the second end of the fourth electrically conductive structure.
 5. The semiconductor component of claim 4, further including: a fifth electrically conductive structure having first and second ends and a body region between the first and second ends, the first end of the fifth electrically conductive structure between the first ends of the second and fourth electrically conductive structures; a third bond wire having first and second ends, wherein the first end of the third bond wire is electrically coupled to the first end of the fifth electrically conductive structure and the second end of the third bond wire is electrically coupled to the second end of the first electrically conductive structure; and a fourth bond wire having first and second ends, wherein the first end of the fourth bond wire is electrically coupled to the first end of the fourth electrically conductive structure.
 6. The semiconductor component of claim 5, further including: a sixth electrically conductive structure having first and second ends and a body region between the first and second ends, the first end of the sixth electrically conductive structure between the second ends of the first and the fifth electrically conductive structures and the second end of the fourth bond wire electrically coupled to the second end of the sixth electrically conductive structure; a fifth bond wire having first and second ends, the second end of the fifth bond wire electrically coupled to the second end of the fifth electrically conductive structure; a seventh electrically conductive structure having first and second ends, the first end of the seventh electrically conductive structure laterally between the first ends of the fourth and sixth electrically conductive structures; a sixth bond wire having first and second ends, the first end electrically coupled to the first end of the sixth electrically conductive structure; an eighth electrically conductive structure having first and second ends, the second end laterally between the second ends of the fifth and seventh electrically conductive structures, and the second end of the sixth bond wire electrically coupled to the second end of the eighth electrically conductive structure; a seventh bond wire having first and second ends, the second end electrically coupled to the second end of the seventh electrically conductive structure; and an eighth wire bond having first and second ends, the first end electrically coupled to the second end of the second electrically conductive structure.
 7. The semiconductor component of claim 6, wherein the first, third, fifth, and seventh electrically conductive structures comprise electrically conductive strips formed from a first common metallization system and the second, fourth, sixth, and eighth electrically conductive structures comprise electrically conductive strips formed from a second common metallization system.
 8. The semiconductor component of claim 7, further including first and second contacts, wherein the first end of the eighth wire bond is electrically coupled to the first contact and the first end of the seventh wire bond is electrically coupled to the second contact, and wherein the first end of the third electrically conductive structure serves as a terminal, the first contact serves as a second terminal, the second contact serves as a third terminal, and the first end of the eighth electrically conductive structure serves as a fourth terminal.
 9. A semiconductor component, comprising: a first coil having a first set of coil elements comprising a first set of electrically conductive strips and a second set of coil elements comprising a first set of bond wires; and a second coil having a second set of coil elements comprising a second set of electrically conductive strips and a second set of coil elements comprising a second set of bond wires.
 10. The semiconductor component of claim 9, wherein each electrically conductive strip of the first set of electrically conductive strips has first and second ends, the second end of a first electrically conductive strip of the first set of electrically conductive strips coupled the first end of a second electrically conductive strip of the first set of electrically conductive strips via a first bond wire of the first set of bond wires and the second end of the second electrically conductive strip of the first set of electrically conductive strips coupled to the first end of a third electrically conductive strip of the first set of electrically conductive strips by a second bond wire of the first set of bond wires, and wherein each electrically conductive strip of the second set of electrically conductive strips has first and second ends, the second end of a first electrically conductive strip of the second set of electrically conductive strips coupled to the first end of a second electrically conductive strip of the second set of electrically conductive strips by a first bond wire of the second set of bond wires and the second end of the second electrically conductive strips of the second set of electrically conductive strips coupled to the first end of a third electrically conductive strip of the second set of electrically conductive strips by a second bond wire of the second set of bond wires.
 11. The semiconductor component of claim 10, wherein the first set of electrically conductive strips includes a fourth electrically conductive strip having a first end coupled to the second end of the third electrically conductive strip of the first set of electrically conductive strips by a third bond wire of the first set of bond wires, and wherein the second set of electrically conductive strips includes a fourth electrically conductive strip having a first end coupled to the second end of the third electrically conductive strip of the second set of electrically conductive strips by a third bond wire of the second set of bond wires.
 12. The semiconductor component of claim 11, wherein the first set of bond wires includes a fourth bond wire coupled to the second end of the fourth electrically conductive strip of the first set of electrically conductive strips and the second set of bond wires includes a fourth bond wire coupled to the second end of the first electrically conductive strip of the second set of electrically conductive strips.
 13. A semiconductor component, comprising: a semiconductor material having a major surface; a first metallization system formed over the semiconductor material, the first metallization system comprising at least one electrical interconnect structure; a first dielectric structure formed over the first metallization system; a second metallization system formed over the first dielectric structure, the second metallization comprising a first set of coils; a second dielectric structure formed over the second metallization system; and a third metallization system formed over the second dielectric structure, the third metallization system comprising a second set of coils.
 14. The semiconductor component of claim 13, wherein the first metallization system and second metallization systems comprise electroplated metals.
 15. The semiconductor component of claim 13, wherein the second and third dielectric structures comprise polyimide.
 16. The semiconductor component of claim 15, further including a third dielectric structure formed over the second metallization system.
 17. A method for manufacturing a semiconductor component, comprising: providing a semiconductor material having a major surface; forming a first metallization system over the semiconductor material; forming a first dielectric structure over the first metallization system; forming a first template over the first dielectric structure, the template having openings that expose portions of the first dielectric structure; forming a second metallization system on the exposed portions of the first dielectric structure; forming a second dielectric structure over the second metallization system; forming a second template over the second dielectric structure, the template having openings that expose portions of the second dielectric structure; and forming a third metallization system on the exposed portions of the second dielectric structure.
 18. The method of claim 17, wherein forming the first template comprises forming a first photoresist structure over the first dielectric structure, the first photoresist structure having openings that expose the portions of the first dielectric structure.
 19. The method of claim 18, wherein forming the second metallization system includes forming a first seed layer on the exposed portions of the first dielectric structure and electroplating a first electrically conductive material on the first seed layer.
 20. The method of claim 19, wherein forming the second template comprises forming a second photoresist structure over the second dielectric structure, the second photoresist structure having openings that expose the portions of the second dielectric structure.
 21. The method of claim 20, wherein forming the third metallization system includes forming a second seed layer on the exposed portions of the second dielectric structure and electroplating a second electrically conductive material on the second seed layer.
 22. The method of claim 17, wherein forming the first dielectric structure includes forming a first layer of polyimide and forming the second dielectric structure includes forming a second layer of polyimide. 